Thermal building- Title

Thermal Building Component Model

Thermal building - Model overview

Model Overview

Author / organization: Alexander Engelmann / KIT


  • Thermal storage
  • Energy conversion device

Intended application: MPC-based predictions of temperature trajectories

Modelling of spatial aspects:

  • Lumped (single device)
  • Averaged (multiple devices)

Model dynamics: Dynamic

Model of computation: Time-continuous

Functional representation: Explicit

Thermal building- input and output

Input and Output

Input variables :

  • controllable inputs collected in a vector-valued function
  • Uncontrollable disturbances acting on the model

Output variables: Identical to the system state

Thermal building - related documents

Thermal building - description

Short Description

State-space model of the thermal behaviour of KIT Flexoffice. This model is a trade-off between model accuracy (which means capturing the relevant effects in the thermal building behaviour) and keeping the model computationally tractable for optimization-based control via MPC. In order to do so, each story of the building is modelled as a thermal zone with a unified air temperature. Components made of concrete (i.e., walls and ceilings) are modelled with their own thermal behaviour.

Thus, the thermal behaviour is aggregated on a story level and neglects thermal effects within the individual stories. For tractability, a linear RC-equivalent circuit is used, which is common in the field of MPC for buildings, leading to a lumped-parameter model consisting of thermal resistances (R) and capacitances (C). The model is based on first-principles for heat, diffusion, dissipation and storage. All these effects are considered in a linear fashion

Present use / development status


Thermal building

Model Details